TG 30 Thermal Compound 4g

Condition: New
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In stock
CLO023GROSGMA
Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs
Brand:
Thermaltake
Condition:
Condition: New
GTIN:
841163075845
Mfg Part #:
CL-O023-GROSGM-A
Part #:
CLO023GROSGMA
Weight:
0.13

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